Full Job Description
Qualifications
Experience/Competencies: – 5+ years of experience in the development of competitive Packages for high speed products like CPUs/ASICs/Chipsets/GPUs. – Strong understanding of package substrate design and package assembly rules. – Must have solid experience in designing packages with Mentor Graphics (Expedition) – Exposure to different Package technologies, an advantage. – Proven stakeholder management skills, in a global set-up, with technical teams spread across different geos. – Master’s in Electrical/Mechanical/Materials Sc and Engg with 2+ years experience or Bachelor’s/Associate degree with 5+ years experience. – Cross-functional experience and proven self-learning abilities with new design tools, flows, and methods will be advantageous.
Inside this Business Group
The focus of Accelerated Computing Systems and Graphics (AXG) is to accelerate our execution in strategic growth areas of high-performance computing and graphics. AXG is chartered with delivering high performance computing and graphics solutions (IP, Software, Systems), for both integrated and discrete segments across client, enterprise and data center. Our mission is to make zeta-scale computing accessible to every human on the planet by the end of this decade and to entertain, educate and connect billions of people with buttery smooth visual experiences.
Other Locations
India, Hyderabad
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